| 摘要 |
PURPOSE:To provide a method and an apparatus for forming a lead with improved accuracy, by preventing a soldering material from adhering to a lead forming die like a tie-bar cutting die. CONSTITUTION:A lead forming apparatus has a pair of upper and lower protective covers 7. The semiconductor device is shielded with its lead 31 still projected outward by this protective covers 7 after the semiconductor device 3 is separated from a lead frame 1. Moreover, the lead forming apparatus includes a plating material spraying unit 9 for spinkling solder powder 8 used as a plating material and, plating the lead 31. |
