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发明名称
Verfahren und Einrichtung zum Reflow-Löten von Elektronik-Bauteilen auf eine Leiterplatte
摘要
申请公布号
DE4016366(C2)
申请公布日期
1994.04.28
申请号
DE19904016366
申请日期
1990.05.21
申请人
SIEMENS NIXDORF INFORMATIONSSYSTEME AG, 33102 PADERBORN, DE
发明人
VOLK, HELMUT, 33100 PADERBORN, DE
分类号
B23K1/008;H05K3/34;(IPC1-7):H05K3/34;B23K1/005;F27B9/12
主分类号
B23K1/008
代理机构
代理人
主权项
地址
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