| 摘要 |
An injection molding compound comprising elongated granules, each of said granules containing a bundle of elongated composite fibers, which have a semimetallic core and at least one relatively thick uniform and firmly adherent, electrically conductive coating comprising copper on said core, said fibers extending generally parallel to each other longitudinally of the granule and substantially uniformly dispersed throughout said granule in a thermally stable, film forming thermoplastic adhesive. |
