摘要 |
A cyanoacrylate monomer adhesive formulation which has improved thermal properties resulting from the inclusion in the formulation of an effective amount for enhancing the thermal resistance of the cured polymer of a compound of the formula: (* CHEMICAL STRUCTURE *) where R is C(CN)2, C(CO2Re)2, C(SO2Re)2 or C(Ph)2; Ra, Rb, Rc and Rd are independently H, monovalent hydrocarbon, halogen or strong electron withdrawing groups; or two of Ra, Rb, Rc and Rd combined form a fused hydrocarbon ring; R1 is C(CN)2, C(CO2Re)2, C(SO2Re)2 or C(Ph)2, or R1 and Rb combined form a fused ring having a C(CN)2, C(CO2Re)2, C(SO2Re)2 or C(Ph)2 group in conjugation with R; Re is alkyl and Ph is phenyl or R and R1 are both O; and Ra, Rb, Rc and Rd are independently H, monovalent hydrocarbon, halogen, hydroxyl, alkoxyl or strong electron withdrawing groups, or two of Ra, Rb, Rc and Rd combined form a fused hydrocarbon ring, provided that at least two of Ra, Rb, Rc and Rd are halogen or strong electron withdrawing groups, or R is is O; R1 is C(CN)2, C(CO2Re)2, C(SO2Re)2 or a diphenylmethylene group, the phenyl groups of which may be optionally substituted with one or more halo, hydroxyl, alkoxyl, hydrocarbon, nitro, acyloxy or cyano groups; and Ra, Rb, Rc and Rd are independently H, monovalent hydrocarbon, halogen or strong electron withdrawing groups, or two of Ra, Rb, Rc and Rd combined form a fused hydrocarbon ring.
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