| 摘要 |
PURPOSE:To make small the pitch between the outer leads of a hybrid integrated circuit device with IC chips mounted on a printed-wiring board and to lessen the member of through holes in the board. CONSTITUTION:A hybrid integrated circuit device has each wiring pattern 2, which consists of a copper foil, on both surfaces of an organic base material 1 and outer leads 7a and 7b, which consist of a copper foil, on both surfaces of the organic base material 1 and outside of the surfaces in the directions of the end parts of the base material 1 and after IC chips 8a and 8b are mounted, the outer leads 7a and 7b on both surfaces of the above base material 1 are electrically connected to each other. |
