| 摘要 |
PURPOSE:To provide a package for accommodation of a semiconductor element which can operate a semiconductor integrated circuit element normally and stably extending for a long period by enabling the heat generated during the operation of the semiconductor integrated circuit element to be radiated into the air favorably. CONSTITUTION:This is a package for accommodation of a semiconductor element, which accommodates a semiconductor integrated circuit element 4 airtightly inside, consisting of an insulating substrate 1 having a plurality of metallized wiring layers 5 and a cover 2, and the said insulating substrate 1 is made of a glass ceramic sintered substance, and also a heat conductor B of 50W/m.K or more in heat conductivity is buried inside. |
