| 摘要 |
PURPOSE:To control the soldering properties such as the thickness, dispersion, etc., of molten solder film onto work, lead parts by fitting a heating system to an upper block. CONSTITUTION:For example, the molten solder solution 31 driven by a pump to rise up in a solder feeding trench is filled in a path 38 while surplus solution 31 runs down from the circumferential surface and package path trenches 39, 40 to a molten solder vessel. At this time, an upper block 37 is heated by a heating system 56 so as to lessen the temperature difference from the molten solder solution 31. In such a state, when the lead frame 1 passes through the path 38, 40, the molten solder solution 31 is made adhere to the lead part to be shifted to the exhaust side. On the exhaust side, the heating gas is jetted from a gas jetting nozzle 57 to the lead frame 1 to form almost even solder film. Through these procedures, the thickness and the adherence receptor of the solder film can be equalized. |
