| 摘要 |
PURPOSE:To restrain the abrasion due to contact of a wire by a method wherein, when a semiconductor chip is connected, a wire clamp plate which holds the wire is formed of a sintered body of titanium boride. CONSTITUTION:A wire clamp plate 10 is provided with a fixed plate 11 which is held by a proper holding body and with a movable plate 12 which is held by a proper holding body so as to face the fixed plate 11 and which holds a wire W made of gold or the like in coorporation with the fixed plate 11. Since the wire clamp plate 11 is formed wholly of a sintered body of titanium boride at this time, the abrasion due to contact of the wire W can be restrained sufficiently and its life can be made long. |
