Halbleiteranordnungen mit supraleitenden Verbindungen.

摘要

A semiconductor device (10) which includes either a single semiconductor chip (20) bearing an integrated circuit (IC) or two or more electrically interconnected semiconductor chips, is disclosed. This device includes interconnects (500, 600, 700) between device components (on the same chip and/or on different chips), at least one of which includes a region (800) of superconducting material, e.g., a region of copper oxide superconductor having a Tc greater than about 77K. Significantly, to avoid undesirable interactions, at high processing temperatures, between the superconducting material and underlying, silicon-containing material (which, among other things, results in the superconducting material reverting to its non-superconducting state), the interconnect also includes a combination of material regions which prevents such interactions.