发明名称 Lead frame
摘要 A lead frame for a rectangular flat package has dumb bars connecting the lead terminals and dam bar coupling portions at the corners of the frame in which the coupling portions are notched to permit the adjacent dam bars to have the same length as the other dam bars, permitting them to be cut away by the same punch. This arrangement permits an increase in the length of the nicked part of the corner of the resin body of the flat package, at which a gate for injection-molding of a resin is located, thereby avoiding chipping of the resin body when excess resin from the injection is removed.
申请公布号 US5304841(A) 申请公布日期 1994.04.19
申请号 US19930045892 申请日期 1993.04.12
申请人 ROHM CO., LTD. 发明人 NEGORO, ATSUHITO
分类号 H01L21/56;H01L21/48;H01L23/28;H01L23/495;H01L23/50;(IPC1-7):H01L23/48;H01L29/44;H01L29/52;H01L29/60 主分类号 H01L21/56
代理机构 代理人
主权项
地址