发明名称 Film-type power resistor combination with anchored exposed substrate/heatsink
摘要 The film-type electrical power resistor includes a flat ceramic chip on the upper surface of which is screen-printed a resistive film. Terminals (leads) are mechanically and electrically connected to the upper chip surface, the terminals being such that the chip may be positioned by the terminals in a predetermined position in a mold cavity during manufacture of the resistor-prior to introduction of synthetic resin. The synthetic resin forms a molded electrically insulating body that embeds the portions of the terminals that are relatively near the chip, and also embeds the upper portion of the chip, but does not embed the bottom surface of the chip. The relationships are such that the lower chip surface may be engaged flatwise with a flat region of a chassis or heatsink. Accordingly, the chip is a substrate for the film, a heatsink for the film, an insulator maintaining the film electrically insulated from the chassis, and a spacer maintaining the terminals spaced from the chassis. The resistor does not contain any metal layer that is either in an electric circuit or projects outwardly relative to the edges of the chip. To permit assembly of the resistor with a chassis or heatsink, a bolthole extends through the body at a region outside the chip.
申请公布号 US5304977(A) 申请公布日期 1994.04.19
申请号 US19920863851 申请日期 1992.04.06
申请人 CADDOCK ELECTRONICS, INC. 发明人 CADDOCK, JR., RICHARD E.
分类号 H01C1/034;H01C1/084;H01C1/14;H01C7/00;H01C17/06;(IPC1-7):H01C1/034 主分类号 H01C1/034
代理机构 代理人
主权项
地址