发明名称 PHOTOMASK FORMING METHOD
摘要 <p>PURPOSE:To vertically finish the cross section of a pattern at the time of forming a photomask with a multilayer pattern of the antireflection film and light-shielding metallic thin film formed on a glass substrate. CONSTITUTION:Electron-beam exposure, development and post baking are carried out, the product is resist-patterned, and the antireflection films 2 and 2' and the light-shielding metallic thin film 3 are simultaneously dry-etched with the patterened product as the mask. In this case, the oxygen content of the gaseous reactant is changed, and etching is conducted in a stepwise manner to form the pattern.</p>
申请公布号 JPH06102656(A) 申请公布日期 1994.04.15
申请号 JP19920254682 申请日期 1992.09.24
申请人 MITSUBISHI ELECTRIC CORP 发明人 IMAI TADAYOSHI
分类号 G03F1/54;G03F1/68;G03F1/80;H01L21/027;(IPC1-7):G03F1/08 主分类号 G03F1/54
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