| 摘要 |
<p>PURPOSE:To prevent short-circuit of the lead wire by absorbing connecting metal running out with a recess provided near the connection point of the lead wire when the lead wire having a plating layer on the surface thereof is connected to the electrode provided on the semiconductor element. CONSTITUTION:A lead wire 13 having a tin plating 13' on the surface thereof is connected to a projected electrode 12 formed on a semiconductor element 1 employing a gold-tin eutectic alloy 15. In this process, a recess 17 is formed on the lead wire near a point surrounding the electrode 12 to absorb excess alloy running melted by heat during the connection through the surface tension. This eliminates metal grain mass which otherwise causes a short-circuit of the lead wire. Even if a lead wire having a thick plating layer is used to improve the wetting property of the solder, the reliability of the element will not be lowered.</p> |
