| 摘要 |
PURPOSE:To enhance the reliability upon the package of a base chip simultaneously facilitating the release thereof from a printed substrate in relation to the title packaging structure of the bare chip used for the circuit constitution of various electronic equipments. CONSTITUTION:Within a bimetal 14 molded by affixing a high expansion board 14-1 and low expansion board 14-2 in different thermal expansion coefficients to each other in the dimension not to interfere with the lead terminals 2a of a bare chip 2, the high expansion board 14-1 side of the bimetal 14 is fixed to the central part of the packaging surface encircled by said lead terminals 2a of the bare chip 2 while the low expansion board 14-2 side is fixed to the main surface of a printed-substrate 1 through the intermediary of a bonding agent in the pressure-welded state on the junction pads 1a of the printed- substrate 1. |
