| 摘要 |
<p>PURPOSE:To fabricate a ceramic multilayer circuit board with high accuracy in positioning of printed patterns and in lamination adhesion of green sheets. CONSTITUTION:A thick-film conductive paste wherein a solvent of vehicle for a thick-film conductive paste is within a range defined by composition points (A), (B), (C), (D), (E) and (F) (unit: wt.%). Kinds of the solvent: (A), (B), (C), (D), (E), (F). (a) diethylene glycol mono-butyl ether acetate: 30, 40, 80, 80, 50, 30. (b)di-(2-ethylhexyl phthalate): 20, 10, 10, 20, 50, 50. (c) alpha-terpineol: 50, 50, 10, 0, 0, 20.</p> |
