| 摘要 |
<p>PURPOSE:To provide a semiconductor device mounting structure for mounting a plurality of semiconductor devices at high density with short wiring length while dissipating heat efficiently to the outside. CONSTITUTION:The mounting structure comprises a first semiconductor device 1 having outer leads 4 fixed to a package 3 and a plurality of connecting electrodes 5 arranged on the surface of the package 3 while being connected electrically with a semiconductor element mounted on the package 3, and a second semiconductor device having external terminals 10 arranged on one end face of a package 9 while corresponding with the connecting electrodes 5 of the first semiconductor device 1. A plurality of second semiconductor devices 2 are mounted, at a predetermined interval, on the surface of the package 3 of the first semiconductor 1 while connecting the external terminals 10 with the connecting electrodes 5.</p> |
