| 摘要 |
<p>PURPOSE:To provide a semiconductor device having a heat radiating section that has superior heat radiation properties and moldability and is consistent in thermal expansion characteristic with a sealing resin, and a heat radiating member for the semiconductor device. CONSTITUTION:In a resin sealed type semiconductor device in which a semiconductor chip 14 is sealed with a sealing resin 12, part of the sealing resin is formed into a heat radiating section 10 that is made of resin including carbon fiber.</p> |
