发明名称 |
Method of forming a bump electrode and manufacturing a resin-encapsulated semiconductor device |
摘要 |
A method of making a bump electrode having a protrusion. The protrusion is made of a folded wire whose tail is bonded to a cavity on the base of the bump electrode. A method of manufacturing a resin sealed semiconductor device encapsulating a chip equipped with bump electrodes is also presented.
|
申请公布号 |
US5299729(A) |
申请公布日期 |
1994.04.05 |
申请号 |
US19920937466 |
申请日期 |
1992.08.28 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
MATSUSHITA, AKIRA;KONISHI, HIDEKAZU |
分类号 |
B23K20/00;H01L21/60;H01L23/485;(IPC1-7):B23K31/02 |
主分类号 |
B23K20/00 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|