Metallic contact surfaces for semiconductor substrate - with opposing edges of adjacent contacts surfaces parallel to crystallographic grid direction of semiconductor

摘要

The metallic contact surfaces (2) lie adjacent one another on the surface of the semiconductor substrate (1) with their opposing edges at a relatively sort distance apart. These edges lie parallel to a crystallographic grid direction of the semiconductor. Pref. the contact surfaces comprise a multi-layer system with AuSn alloy, Ti, Pt, and Au layers in succession. A narrow contact surface strip (3) is pref. provided between the opposing edges of the adjacent contact surfaces. ADVANTAGE - Prevents edge roughness of metallic contact layers.