发明名称 |
METHOD AND APPARATUS FOR ELECTROLYTICALLY PLATING COPPER |
摘要 |
A method for electrolytically plating copper onto a base metal, such as steel (18), utilizing an insoluble anode (16) includes the steps of: providing a pyrophosphate plating solution (14); adding a copper source, copper hydroxide, to the plating solution (14); and passing an electric current through the plating solution between the insoluble anode (16) and the base metal (18) to be plated. The apparatus (10) includes a plating tray (12), a pyrophosphate plating solution (14) including a soluble source of copper, an insoluble anode (16) and a power source (20). A copper plated product (P) is also disclosed and claimed. |
申请公布号 |
WO9406953(A1) |
申请公布日期 |
1994.03.31 |
申请号 |
WO1992US07808 |
申请日期 |
1992.09.15 |
申请人 |
ATR WIRE & CABLE CO., INC. |
发明人 |
GLAFENHEIN, KARL, L.;MURPHY, DAVID, A.;WHITE, CHARLES, N.;HACHISUKA, SHUNJI |
分类号 |
C25D3/38;C25D5/26;C25D21/14;(IPC1-7):C25D3/38 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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