发明名称 |
EPOXY RESIN COMPOSITION AND COPPER-CLAD LAMINATE |
摘要 |
EPOXY RESIN COMPOSITION AND COPPER-CLAD LAMINATE An epoxy resin composition excellent in heat resistance and low in dielectric and a copper-clad laminate obtained by molding it are disclosed. The epoxy resin composition of the invention comprises: (1) a compound obtained by previously reacting (A) an epoxy resin obtained by glycidyl etherifying a 3-methyl-6-(C4-C8)alkylphenol novolak with (B) a halogen-containing bisphenol compound represented by the following formula (1): (1) <IMG> wherein R1 represents a hydrogen atom or a methyl group and the two R1 may be identical or different, X and X1 represent halogen atom and may be identical or different, and i and j independently one another are integers of 1 to 4, or a compound obtained by previously reacting (A) the above epoxy resin, (B) the above halogen-containing bisphenol compound and (C) a glycidyl etherification product of a halogen-containing bisphenol compound which is represented by the following formula (2): <IMG> (2) wherein R2 represents a hydrogen atom or a methyl group and the two R2 may be identical or different, Y and Y' represent halogen atom and may be identical or different, n represents an average recurring unit number and is 0 to 10 and k and 1 independently one another are integers of 1 to 4, and (2) an epoxy hardener.
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申请公布号 |
CA2106709(A1) |
申请公布日期 |
1994.03.23 |
申请号 |
CA19932106709 |
申请日期 |
1993.09.22 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
UEDA, YOICHI;ENDO, YASUHIRO;SHIBATA, MITSUHIRO;KAMIO, KUNIMASA;KITAYAMA, SHINICHIRO;YAMASAKI, KAORI;HAYASHI, TOSHIAKI |
分类号 |
B32B15/08;C08G59/06;C08G59/08;C08G59/38;C08L63/00;H05K1/03;(IPC1-7):C08G59/20;B32B15/14 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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