发明名称 Badkontrolle Kupfer-haltiger Metallbehandlungsbäder
摘要 The invention relates to a process for the electrochemical determination and adjustment of the copper concentration in which: a) the copper concentration in the bath solution is found by cathodically depositing a proportion of the quantity of copper proportional to the copper concentration on an electrode, b) anodically detaching the separated quantity of copper, and c) measuring the charge quantity used for complete detachment, d) calculating the quantity of copper needed to set the copper concentration at a predetermined set value and the charge quantity needed to dissolve this quantity of copper anodically from a copper anode from the copper concentration found, and e) causing the calculated charge quantity to flow through an electric circuit which comprises the treatment solution as electrolytes and the copper electrodes immersed in the treatment solution as anodes. The individual steps in the determination and the adjustment may also be performed separately from one another.
申请公布号 DE4231273(A1) 申请公布日期 1994.03.24
申请号 DE19924231273 申请日期 1992.09.18
申请人 HENKEL KGAA, 40589 DUESSELDORF, DE 发明人 ENDRES, HELMUT, DR., 4018 LANGENFELD, DE;SPECKMANN, DIETER, DR., 4018 LANGENFELD, DE;WIECHMANN, FRANK, 4000 DUESSELDORF, DE;GOTTWALD, KARL-HEINZ, 5042 ERFSTADT, DE
分类号 C23C22/77;C25D21/14;G01N27/42;G01N27/48;(IPC1-7):G01N33/20;C23C22/86 主分类号 C23C22/77
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