发明名称 AUTOMATIC TRANSSHIPPING DEVICE FOR WAFERS
摘要 <p>PURPOSE:To shorten transshipping time for each wafer as well as to prevent the occurrence of defects, the adhesion of foreign matters and the formation of natural oxide films. CONSTITUTION:A space (d) is kept between a connecting stem 1-4 connecting the fork 1-1 of a process jig parallel and the bottom section of the wafer resting groove 1g of the process jig, and a plurality of buffer forks 2 transshipping each wafer 3 from a transport jig fork 5-1 to the process jig is so constituted as to be inserted/pulled out therein/thereof, and also as to be moved up and down. By this constitution, the transshipment of each wafer 3 in a lump into the process jig 1 enables a number of wafers 3 to be transshipped to the process jig in a short time, allows time required for transshipment to be shortened, and prevents the occurrence of detects, the adhesion of foreign maters and the formation of natural oxide films, so that transshipping efficiency is thereby enhanced.</p>
申请公布号 JPH0680208(A) 申请公布日期 1994.03.22
申请号 JP19920233869 申请日期 1992.09.01
申请人 HITACHI LTD 发明人 TSUJI YOICHIRO
分类号 B65G1/04;B65G1/00;H01L21/677;H01L21/68;(IPC1-7):B65G1/04 主分类号 B65G1/04
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