发明名称 Method of manufacturing electronic components
摘要 A method for efficiently forming external electrodes of desired thicknesses on chip electronic components such as multilayer ceramic capacitors. Cutting grooves are formed in a block along surfaces to be provided with external electrodes. The block is divided into individual chips after metal paste for forming external electrodes is cast into the cutting grooves and dried. The metal paste filling up each of the cutting grooves is cut with a blade to be divided into two parts. The two parts of the metal paste thus formed with the blade define external electrodes. The present invention can also be applied to form external electrodes in an electronic component array comprising a plurality of electronic component elements.
申请公布号 US5295289(A) 申请公布日期 1994.03.22
申请号 US19920955838 申请日期 1992.10.02
申请人 MURATA MANUFACTURING CO., LTD. 发明人 INAGAKI, YASUTO;KOHNO, YOSHIAKI
分类号 H01C17/28;H01G4/232;H01G4/248;H01G4/30;H01G13/00;(IPC1-7):H01G4/30 主分类号 H01C17/28
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