| 摘要 |
PURPOSE:To obtain an LED excellent in characteristics with high reproducibility, by connecting an element chip using an insulative substrate with a lead member, by using die bonding together with wire bonding. CONSTITUTION:When a lead member has a notch part, the electrode part 18 of an element chip 20 is connected with a lead member 16 by a bonding method, and then an electrode 19 is connected with a lead member 15 by using a wire. When a lead member has a hole part, an electrode part 18 of the element chip 20 is connected with the lead member 22 by a die bonding method, and then the electrode 19 is connected with a lead 21 by using a wire. As the material for die bonding of the light emitting chip and the lead member, e.g. Au-Si, Pb-Sn alloy based solder is used. Thereby a stable LED of high quality is obtained. |
