| 摘要 |
<p>PURPOSE:To accomplish the certainty of installation of a chip resistor on a printed substrate and the like and the smooth taking in and out of a chip resistor to and from a tube in the automatic installation when the chip resistor is inserted into the tube and then it is taken out and automatically installed on a printed substrate and the like. CONSTITUTION:The pickup by a vacuum-suction collet is brought into a highly reliable state by forming both the cover coat covering the resistance film 4, provided on the upper surface of an insulated substrate 2, and the auxiliary upper-surface electrode film 7, covering the main upper-surface electrode film 3, almost in the same height, and the defective soldering when the above- mentioned films are attached to a printed substrate by turning inside out is prevented. By narrowing the width of the main upper-surface electrode film 3 and the auxiliary upper-surface electrode film 7 than the insulating substrate 2, the clinching of the auxiliary upper-surface electrode film 7 to the inner surface of a tube D can be prevented.</p> |
