| 摘要 |
PURPOSE:To produce a multilayer printed wiring, suitable for mounting insertion type electronic components, without requiring any troublesome step by coating the surface of a conductive paste layer with a gold plating layer thereby forming a through conductor layer. CONSTITUTION:Main surface of a thermoplastic resin layer 1 is coated with a conductor pattern 2 of required paste and then the thermoplastic resin layer 1 is positioned and laminated to be integrated through hot press. A connecting through hole 3 is made at a predetermined position through the integrated laminate and subsequently applied with a conductive paste layer 4b on the inner wall face thereof. A gold plating layer 5 is then applied on the conductive paste layer 4b thus forming a through conductor layer. plating layer 5 applied on the conductive paste layer 4b ensures formation of a uniform and highly reliable conductive layer. Furthermore, since each circuit pattern is formed through printing of conductive paste, improvements can also be achieved in the aspects of cost and productivity. |
