| 摘要 |
A molded plastic package (40) for an integrated-circuit die (26) includes a lead frame having a central die-attach paddle (12). One side of the die-attach paddle has an integrated-circuit die fixed thereto. A heat sink member (20) is resiliently fixed to the other side of the die-attach paddle using a layer of viscous thermal grease (24) between the heat sink member and the other side of the die-attach paddle. One or more holes which are formed in the lead frame are engaged by corresponding studs (24C, 24D) on the heat sink. The stud has a shoulder portion (74) which engages the lead frame to prevent the stud from further passing through the hole in the lead frame. |
