发明名称 Stress-free mounting and protection of liquid-cooled solid-state laser media.
摘要 A laser structure that reduces thermally-induced mounting stress on low fracture strength solid-state laser rods (e.g. Nd:YLF). A transparent sleeve (14) of relatively high strength optical material that has relatively high thermal conductivity (e.g. MgF2 or Al2O3) is provided around the laser rod (13), and a thin layer (15) of elastomer (e.g. of a silicon gel) is provided between the laser material and the transparent sleeve. This arrangement of laser material, transparent sleeve, and elastomer allows sealing of a cooling fluid flow channel (20) disposed around the laser/sleeve assembly using conventional means without applying stress directly to the laser rod material. This reduces the risk of fracturing the laser rod material due to thermal expansion near the seal (24) and allows the laser to be operated at higher average power levels. The elastomer layer and high thermal conductivity sleeve efficiently conduct heat from the laser rod to the surrounding cooling liquid. This structure also minimizes damage to the surface of the strengthened laser rods due to handling and coolant erosion thereby preserving the thermal stress fracture resistance properties of the laser rod during transport, manufacturing assembly, operation, and maintenance. <IMAGE>
申请公布号 EP0587092(A1) 申请公布日期 1994.03.16
申请号 EP19930114281 申请日期 1993.09.06
申请人 HUGHES AIRCRAFT COMPANY 发明人 SUMIDA, DAVID S.;BYREN, ROBERT W.
分类号 H01S3/04;H01S3/042;H01S3/05;H01S3/16 主分类号 H01S3/04
代理机构 代理人
主权项
地址
您可能感兴趣的专利