PACKAGED INTEGRATED CIRCUITS

摘要

HERMETICALLY SEALED INTEGRATED CIRCUITS The present invention provides hermetically sealed integrated circuits which can have a standardized arrangement of external contacts. These circuits comprise a circuit subassembly having external contacts. Onto the surface of the subassembly surrounding the external contacts is formed a first ceramic passivating layer. Next, a non-corroding, conductive layer is formed on the external contacts and portions of the first ceramic passivating layer. Then a second ceramic passivating layer is formed on the non-corroding, conductive layer and that portion of the first passivating layer not covered by the non-corroding, conductive layer. Finally, the second passivating layer is etched through to the conductive layer to allow external contact with the circuit. The present invention also relates to methods for producing the above integrated circuits.