| 摘要 |
<p>PURPOSE:To provide an economical manufacture of a copper lined laminated board wherein an extremely thin copper film is produced to form a fine circuit with high accuracy. CONSTITUTION:In a process for manufacturing a copper lined laminated board by joining a copper foil and a base prepreg by thermo compression bonding, electroless plating is applied to the surface of an insulating material or electroplating is applied following the electroless plating to form a copper film and the copper film is brought into close contact with the base prepreg to effect thermo compressing bonding, and thereafter the copper film and the insulating material are separated. As a result, a copper lined laminated board wherein extremely thin copper films, which have been difficult to obtain, are formed can be obtained in a simple manner at low cost, whereby a printed circuit board of high density having fine circuit can be manufactured at low cost.</p> |
