UV-Lichtdurchlässiges Gehäuse für integrierte Schaltungen.

摘要

The present invention relates to a semiconductor casing which permits transmitting ultraviolet rays to a semiconductor chip within the casing. The semiconductor casing includes the substrate formed by a thin metal plate (11) for mounting the semiconductor chip (14), a ceramic frame (12) fixed to the periphery of the substrate, a ceramic cap (19) which covers the semiconductor chip, is mounted on the ceramic frame and allows transmission of ultraviolet rays, and leads (16) which are sandwiched between the ceramic frame and the ceramic cap to allow the electrical connection of the semiconductor chip.