| 摘要 |
PURPOSE:To achieve a method for surface-mounted packaging electronic parts which can prevent solder on a lead terminal surface from being oxidized and at the same time can prevent soldering property from deteriorating. CONSTITUTION:A surface-mounted aluminum electrolytic capacitor 13 with lead terminals 13a and 13b is filled into an embossed pocket 12 formed in an emboss tape main body 11, air inside the embossed pocket 12 is eliminated, inactive gases 14 such as nitrogen, carbon dioxide, helium, neon, and argon are supplied into the embossed pocket 12 for filling it with them instead, and then packaging is made by sealing the opening of the embossed pocket 12 so that the inactive gases 14 will not be leaked. |
