| 摘要 |
<p>PURPOSE:To obtain a high density mounting module in which an LSI is placed on a thin film multilayer wiring board by setting a thermal expansion coefficient of an entire board to a special value or less. CONSTITUTION:A thin film multilayer wiring board comprises a plurality of thin film wiring layers 4 laminated to be formed with fine wiring pattern on a surface of an insulating layer 1, and a wiring layer (shield layer) 3 made of low thermal expansion metal having an elastic modulus of 100GPa or more and formed between the layers 4 through the layer 1 in such a manner that the entire thermal expansion coefficient is 1X10<-5>K<-1> or less at the ambient temperature. Thus, the layer (the shield layer) 3 having the high elastic modulus restricts the thermal expansions of the layer 1 of organic resin and the layer 4 to suppress the thermal expansion of the entire circuit board thereby to prevent peeling between the wiring layers or crack of the insulating layer, and to prevent peeling, etc., of an LSI chip placed on the board.</p> |
