| 摘要 |
PURPOSE: To secure the connection of low reflection between strips by selecting the distance between a 1st strip line and an inside conductive layer, based on two dielectric constants of a carrier material and the thickness of a 2nd carrier. CONSTITUTION: The width w1* of a 1st strip line 6 is set equal to the width w7 of a 2nd strip line 7, and a 1st feeding carrier material 4 has an additional inside conductive layer 14, that is connected to a reference potential. A distance h1* between the line 6 and the layer 14 is decided, based on the dielectric constants ε1 and ε2 of two carrier materials 4 and 5 for securing matching between the characteristic impedances of the both lines 6 and 7. The layer 14 is easily formed by making it serve as a part of a PC multilayer board and also connecting a continuous inside conductive layer which extends with a sufficient distance h1* to the surface of the layer 14 via a connection structure, that is adaptive to a rear surface grounding plane 8 of the PC multilayer board. |
