| 摘要 |
<p>PURPOSE:To reduce a thermal resistance of a flat package by providing heat dissipation fins of the same material as that of a lead frame at one side of the package. CONSTITUTION:The same metal as that of an island 6 of a lead frame protrudes out of molding resin 1 as a heat dissipation plate 2 at one side of a flat package. A semiconductor chip 4 is placed on the island 6 of the frame, heat generated from the chip 4 is transferred to the island 6 of the frame and to the plate 2 to be dissipated therearound. Thus, the package having small thermal resistance can be obtained. As a result, a circuit having larger power consumption can be integrated.</p> |
