发明名称 SUBSTRATE POSITIONING DEVICE IN SUBSTRATE HEATING/COOLING DEVICE
摘要 <p>PURPOSE:To provide a substrate positioning device for positioning accurately even in the case of a temperature change in a substrate heating/cooling device. CONSTITUTION:In a substrate heating/cooling device having at least one of a heating source and a cooling source, a substrate placing plate 16 for placing a substrate 26 and a constant temperature plate 7 for holding constant a temperature are provided, and a positioning pin 22 is planted in the constant temperature plate 7 and is freely inserted into the substrate placing plate 16 and positions the substrate 26 on the substrate placing plate 16, and the substrate 26 and the substrate placing plate 16 expands or contracts by heating or cooling the substrate 26, but as the positioning pin 22 is planted in the constant temperature plate 7, it does not expand or contract due to a temperature change to accurately position the substrate 26.</p>
申请公布号 JPH0653307(A) 申请公布日期 1994.02.25
申请号 JP19920219838 申请日期 1992.07.27
申请人 KOKUSAI ELECTRIC CO LTD 发明人 NIIMURA NORIHIRO;MORITA FUMIO;SUZUKI MASAYUKI
分类号 B23Q3/18;H01L21/302;H01L21/3065;H01L21/68;(IPC1-7):H01L21/68 主分类号 B23Q3/18
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