| 摘要 |
The method comprises the steps of providing a vessel for containing a solder melt, and a bowl having a horizontal upper rim with an upwardly directed edge extending therealong; immersing the bowl in the solder melt contained in the vessel; lifting the bowl to a position where at least the upper rim is located above the solder melt contained in the vessel, whereby molten solder is drawn by the bowl; dipping conductive elements of a device into the molten solder drawn by the bowl; separating the conductive elements from the molten solder drawn by the bowl; and, immediately after the separation, spinning the device about a substantially vertical axis. The spinning step comprises a first phase of submitting the device to a selected angular acceleration, a second phase, having a selected duration of spinning the device at a selected maximum rotational velocity, and a third phase submitting the device to a selected angular deceleration.
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