A process for removing corrosive by-products from a circuit assembly

摘要

The invention is a process for removing corrosive by-products from semiconductor assembly by applying an aqueous spray comprising a saponifying agent to release and dissolve flux constituents and applying an acidic aqueous spray to the assembly to dissolve metal contaminants. While the acid source in the aqueous spray may be any number of constituents, preferably carbon dioxide is used. Metal released by the aqueous acid spray is inactivated and bound by a chelating agent which is introduced into the wash. The invention is applicable to any semiconductor device or assembly made through processes using bonding materials such as solder which may have by-products which are corrosive or otherwise deleterious to the device or device assembly once placed in the chosen environment of use.