| 发明名称 |
STRUCTURE PROTRUDING ON SUBSTRATE FOR FLIP-CHIP CONNECTION |
| 摘要 |
<p>PURPOSE: To obtain a method for connecting a projection-free flip chip applied, when an integrated circuit chip is attached to a circuit trace. CONSTITUTION: A circuit trace 17 is formed on a dielectric substrate 21, so that the circuit trace 17 includes at least one projected structure 18. An integrated circuit chip 26 is positioned so that a pad 25 is connected to the projected structure 18. A pad 25 is fixed to the projected structure 18 using a plated conductive material 23, such as solder that is inserted between the pad 25 and the projected structure 18.</p> |
| 申请公布号 |
JPH0645403(A) |
申请公布日期 |
1994.02.18 |
| 申请号 |
JP19930040255 |
申请日期 |
1993.03.01 |
| 申请人 |
HUGHES AIRCRAFT CO |
发明人 |
UIRIAMU AARU KURUMURII;HAIMU FUAIGENBAUMU |
| 分类号 |
H01L21/48;H01L21/60;H01L21/68;H01L23/13;H01L23/498;H05K1/18;H05K3/20;H05K3/32;H05K3/34;H05K3/40;(IPC1-7):H01L21/60 |
主分类号 |
H01L21/48 |
| 代理机构 |
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代理人 |
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