| 摘要 |
PURPOSE:To reduce in size a package by bending and superposing an insulation film board which places a semiconductor chip and circuit elements, or spirally winding to mold it. CONSTITUTION:After a semiconductor chip 2 is die bonded to a film 1, it is bonded with a wire 6, then bent along a line B-B', and then molded. A meander type inductor 3c and a spiral inductor 3d are disposed at a lower side of the chip 2 to stereoscopically dispose a circuit, thereby reducing in size a package. An upper layer metal interconnection 3a is connected to a lower layer metal interconnection 5b via a through hole 41 to form an electromagnetic shielding layer, thereby preventing coupling of adjacent signal lines. Further, the chip 2 and the inductors 3c, 3d are electrically separated therebetween, an upper part of the chip 2 is covered with a spacer material having lower dielectric constant than that of a molding material 8 to reduce a parasitic capacity, thereby decreasing deterioration of high frequency characteristics. |
