| 摘要 |
PURPOSE:To make it possible to make the form of electrode plates large and thick, give effective heat sink effect and improve the reliability of a device by making metallic electrode plates of porous conductive metal to which a solder material is sticked by immersion, etc. CONSTITUTION:On a nickel or silver plated copper substrate 2, the anode 7 of a semiconductor pellet 1 is fixed with solder 9 consisting mainly of lead and tin, and also on divided cathodes 8, cathode electrodes 10 are attached. At this time, a usual electrode plate is not used for the electrodes 10, but conductive metal 100 of porous copper, nickel, molybdenum, etc., immersed in solder whose main components are lead and tin is used. By so doing, solder 10 in the small holes of the base material 10 which are connected with outside contributes to the conductivity of heat and solder 10 independent inside acts as a good conductor, and thus high heat sink effect is obtained. Therefore, the deterioration of the pellet 1 is reduced.
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