THERMAL CUT-OUT AND PROCESS FOR ACTIVATING IT

摘要

The thermal cut-out consists of a strip-like leaf spring (1) with contact points (5, 6) at the ends for connection to corresponding circuit contacts (21, 22) on the substrate (20). The leaf spring (1) has a spring arm (4) as a connector between the contact points with a roof-shaped deformation (7) and a spring section (13) connecting thereto. After the leaf spring (1) has been soldered to the circuit contacts (21, 22), pressure distortion of the roof-shaped deformation (7) produces a prestress in the spring arm (4). The thermal cut-out is suitable for circuits in general and especially for film circuits.