发明名称 |
Air coupled ultrasonic transducer |
摘要 |
An acoustic transducer which is operable in air up to at least 2MHz is described. A conducting substrate, usually a silicon wafer is etched to provide a selected pattern of micro pits up to about 30 (my)m or more deep. A dielectric film, such as a polyimide film is placed over the etched surface so as to trap air in each individual pit. A conducting upper layer is then superimposed over the dielectric film. When a potential is applied between the substrate and the upper layer the upper layer is driven into motion and enhanced by the vibrations of the air pockets. Alternatively a smooth substrate may be employed in conjunction with an etched dielectric film to achieve the same result. These transducers are useful for non-destructive testing of large structures or for medical diagnostic and therapeutic purposes, without the need for a liquid or gel coupling agent.
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申请公布号 |
US5287331(A) |
申请公布日期 |
1994.02.15 |
申请号 |
US19920966649 |
申请日期 |
1992.10.26 |
申请人 |
QUEEN'S UNIVERSITY |
发明人 |
SCHINDEL, DAVID W.;HUTCHINS, DAVID A. |
分类号 |
A61B17/22;H04R17/00;(IPC1-7):H04R17/00 |
主分类号 |
A61B17/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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