| 摘要 |
PURPOSE:To improve mounting density by ensuring mounting on the surface of a mounting substrate using any of a transverse mounting method and a longitudinal mounting method, and improving mounting density on the surface of the mounting substrate, and further eliminating a wasteful blank space between adjacent semiconductor devices or between adjacent laminated semiconductor devices. CONSTITUTION:In a semiconductor device 1, an external lead 31 is laid along three surfaces of a sealing structure 6, and the height of the surface of the external lead 31 is adapted to be the same as or lower than that of the sealing structure 6. |
