| 摘要 |
PURPOSE: To cancel increase in inductance with the increase in wire length and to prevent the generation of wire sweeping or wire disturbances. CONSTITUTION: A package comprises a lead frame 12, having a central chip adhered part and first and second groups 16 and 18 of a crossed-finger type. The inner edge of a finger 16 of the first group is at a position closer to the central chip adhering part than that of the inner edge of a finger 18 of the second group. A semiconductor chip having input and output pads are adhered to the central chip adhering part. Each of input and output pads is connected directly to a first group finger in a first group wire, and each of the wires of the second group fingers has a first partition, extending from the input and output pads to the intermediate adhering region and a second partition which extends from the intermediate adhering region to each of the fingers of the second group fingers. |
