| 摘要 |
<p>PURPOSE:To prevent damage on edge portion of a silicon wafer due to its swinging motion when the silicon wafer is in contact with a holding groove of a wafer holding cradle by forming at least the part, which abuts on a product, of a product holding cradle of a material which is smaller in hardness than that of the product. CONSTITUTION:A cradle 1 is formed by a boron doped glass having the Mohr's hardness 6 in the same shape as a silicon wafer holding cradle. Or, the surface of a quartz glass silicon wafer holding cradle 1 having the Mohs hardness 7 is covered with a coating film 4 of boron doped glass having the Mohs hardness 6 which is smaller than that of the silicon wafer. Thereby, damage due to the swinging movement when the silicon wafer edge portion is in contact with the holding groove 2 is almost applied to the side of the holding groove 2 and thereby the silicon wafer edge surface is suffered from little damage, eliminating a problem that a damage is caused to the edge portion of silicon wafer.</p> |
