| 摘要 |
PURPOSE:To carry out highly precise bonding by detecting a pressed state of a leadframe. CONSTITUTION:A first leadframe presser 11-1 is to press an internal terminal 1A of a leadframe 1 against a leadframe bearer 3, and second leadframe pressers 11-2 and 12 are to press a die attachment section 1B of the leadframe 1 against the bearer 3. A lead wire 14A and a lead wire 14B are connected with each other through a control section 21 between the second pressers 11-2 and 12. Electrical conduction between the leadframe pressers 11-2 and 12 through the leadframe 1 is detected. |
