Metal plane support for a multi-layer lead frame and a process for manufacturing it.

摘要

A metal plane support for making multi-layer lead frames for semi-conductor devices has a lead frame support made of a single thin metal strip having a plurality of lead frames (50) continuously arranged in the longitudinal direction. It also has a metal plane support made of a single thin metal strip and including a plurality of metal planes (14, 40), such as power planes or ground planes, continuously arranged in the longitudinal direction corresponding to said plurality of lead frames (50). A pair of side rails (10a, 10b) extend in the longitudinal direction and support the metal planes (14, 40) between them. The metal planes (14, 40) are connected to the side rails (10a, 10b) via separating portions (20) for removing the rails (10) from the metal planes (14, 40) after the metal planes (14, 40) are adhered to the corresponding lead frames (50).