| 摘要 |
<p>PURPOSE:To make it possible to carry out a wafer test effectively, by improving partly a prove chip. CONSTITUTION:A plurality of microwave integrated circuits 12 are disposed in a matrix form on a wafer excluding the dicing lines 13. In each microwave integrated circuit 12, four grounding electrode patterns (G), an input electrode pattern (I), an output electrode pattern (O), and high-frequency power-supply electrode patterns (V1 and V2) are provided. A pair of the grounding electrode patterns (G) formed with the input electrode pattern (I) in between is connected with a pad 14 provided on the dicing lines 13.</p> |
